Micron Technology initiated construction on Wednesday (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to its existing facilities in Singapore.The US memory
Memory prices are declining across all segments and are expected to continue their downward trajectory in the first quarter of 2025, according to industry sources.The memory market has experienced sof
AI and high-performance computing (HPC) are pushing Qualcomm and AMD to escalate their challenge against Intel's decades-long dominance. Through technological innovation and focused channel strate
Micron is aggressively expanding its footprint in the high-bandwidth memory market, capitalizing on surging AI chip demand to accelerate growth. Backing this expansion, the company is set to receive u
After revealing the latest financial results, Micron held an earnings call, discussing the recovery paces across markets. The company is optimistic about the demand for HBM as it continues to secure c
The rapid development of AI, HPC, and other technologies is driving higher demands for semiconductor performance and energy efficiency. Traditional packaging technologies struggle to meet the needs of
