Infineon announced that it has succeeded in developing the world's first 300mm GaN wafer technology for power electronics. This allows for the improvement of efficiency performance, smaller size,
Recently, China has set two records in semiconductor chip sector: first, it mass-produced the world’s first 28nm embedded RRAM image quality adjustment chip; second, it developed the world’s first 16-
Global semiconductor equipment billings increased 4% year-over-year to US$26.8 billion in the second quarter of 2024, while quarter-over-quarter billings edged up 1% during the same period, SEMI annou
Nations building artificial intelligence models in their own languages are turning to Nvidia's (NVDA.O), opens new tab chips, adding to already booming demand as generative AI takes center stage f
Market research firms said in their latest report that although seasonal factors and weaker-than-expected consumer demand affected electronic product sales in the first half of 2024, resulting in a ye
A new contract chipmaking technology, dubbed the backside power delivery network (BSPDN), will reduce the size of a 2-nanometer chip by 17%, compared with the traditional front-end power delivery tech
