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2025-10-30
Samsung reorganizes memory line by accelerating HBM4 production at P4 plant

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Samsung Electronics is transforming its Pyeongtaek Campus Line 4 (P4) in South Korea into a manufacturing base focusing on HBM4 production. Analysts indicate that Samsung is increasing the proportion of AI memory production, shifting its equipment strategy focus from general server DRAM to AI memory products.

According to Ddaily, P4 is currently carrying out phased equipment installation and is expected to begin mass production in 2026. The first phase invests in 1c DRAM production lines corresponding to HBM4. In the first half of 2026, Samsung is estimated to potentially secure a new capacity of about 60,000 wafers per month.

Samsung will reconfigure part of its existing DRAM processes into production lines centered on AI memory and will expand the use of key equipment for high-density processes, including extreme ultraviolet (EUV) lithography and through-silicon via (TSV) packaging.

After losing its leadership in the HBM3E generation to SK Hynix, Samsung aims to regain a competitive edge in speed, efficiency, and stacking stability with HBM4. In addition to the P4 plant, Samsung is also considering converting parts of its Hwaseong and Giheung facilities in South Korea to 1c processes compatible with HBM.

Investing in the P4 plant is not simply capacity expansion, but it demonstrates production line reorganization. P4 is ultimately Samsung's starting point for its transformation toward AI memory, with its product mix shifting from server DRAM to high-value-added products such as HBM and HBM-PIM. It is reported that Samsung also plans to introduce AI memory production and PIM-integrated processes at its future P5 and P6 plants.

Among the world's three major memory manufacturers, Samsung is currently the only one capable of securing new capacity in the short term. SK Hynix and Micron both have limited capacity for large-scale expansion. SK Hynix is focused on efficiency improvements at its M16 plant in Icheon, and Micron is concentrated on its Boise plant.

Most of the new capacity secured at Samsung's P4 plant will be devoted to HBM4 and HBM4E production. As demand for HBM in AI GPUs and server markets increases, HBM-centered investments are expected to offer greater profitability potential than general DRAM.

P4 represents more than just a new production line; it symbolizes Samsung's shift in memory manufacturing. The company intends to expand its business beyond simple memory supply, moving toward providing comprehensive memory solutions optimized for the AI era.

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