Industry association SEMI said semiconductor manufacturers will spend $400 billion on computer chip-making equipment in 2025-2027.Spending on 300mm fab equipment is being driven by regionalization of
Recently, several 6-inch production lines have made significant advancements, focusing on third-generation semiconductor materials like silicon carbide (SiC) and gallium oxide (Ga2O3).NEXIC Successful
Japan's Ministry of Finance reported on the 20th that the country's semiconductor equipment export value to China surged by 61.6% last month, reaching 179.9 billion yen (1.6815 trillion won or
Infineon announced that it has succeeded in developing the world's first 300mm GaN wafer technology for power electronics. This allows for the improvement of efficiency performance, smaller size,
Recently, China has set two records in semiconductor chip sector: first, it mass-produced the world’s first 28nm embedded RRAM image quality adjustment chip; second, it developed the world’s first 16-
Global semiconductor equipment billings increased 4% year-over-year to US$26.8 billion in the second quarter of 2024, while quarter-over-quarter billings edged up 1% during the same period, SEMI annou
